HUTCH is transforming industry-academic collaboration through its Future Connect initiative, which aims to fuel the next generation of tech innovators. Partnering with the Sri Lanka Institute of Information Technology (SLIIT), HUTCH is reshaping how students engage with networking, cloud infrastructure, and data communication technologies through hands-on, immersive learning experiences.
The first session of the Future Connect Programme, held on February 21 at the SLIIT Malabe campus, focused on Networking, Computer Systems, and Cloud Infrastructure Management. HUTCH’s Chief Information Officer, Asanga Ranasinghe, emphasized that the session provided students with insights into industry advancements, helping them bridge the gap between academic knowledge and real-world expectations.
Building on this momentum, an industry visit for the Future Connect programme took place on February 26 at the HUTCH Engineering Complex in Walpola, Ragama. Students explored critical infrastructure components, including the Network Operations Center (NOC), Data Centers, and Battery Rooms, gaining firsthand exposure to the technologies and processes that ensure seamless network performance.
HUTCH’s General Manager of Corporate Affairs, Mangala Bandara, highlighted the company’s commitment to equipping students with industry insights and practical expertise. He stated, “Through initiatives like Future Connect, we are enhancing their technical knowledge and contributing to the development of a highly skilled workforce that will drive Sri Lanka’s digital transformation.”
The Future Connect initiative underscores HUTCH’s dedication to building a future-ready workforce, ensuring that students are well-prepared to meet the demands of Sri Lanka’s rapidly evolving technology sector. By fostering strong collaborations between industry and academia, HUTCH continues to play a key role in advancing digital education and shaping the next generation of ICT professionals.
