Kaynes Semicon, a wholly-owned subsidiary of Kaynes Technology India, inaugurated its first overseas very large-scale integration (VLSI) chip design centre in Muscat, Oman, in partnership with Oman’s Ministry of Transport, Communications and Information Technology and Ministry of Labour.
The new centre will focus on both front-end and back-end chip design processes, providing advanced training to 80–100 students annually in VLSI technologies such as integrated circuit design, chip fabrication, and wafer preparation. Raghu Panicker, CEO of Kaynes Semicon, emphasized that the centre offers access to cutting-edge Electronic Design Automation (EDA) tools and industry-grade simulation environments, equipping students with hands-on experience to contribute immediately to semiconductor projects.
Fully funded by the Oman government, the initiative supports building a robust semiconductor ecosystem beyond India. Ramesh Kannan, MD of Kaynes Technology India, highlighted the company’s goal to extend its semiconductor footprint globally while collaborating with local governments.
Kaynes Semicon is poised to produce India’s first packaged chip by July 2025, following Union Cabinet approval last year for an Outsourced Semiconductor Assembly and Test (OSAT) facility in Gujarat, with a production capacity of 6.3 million chips daily.
This move comes amid growing investments in the Middle East’s semiconductor and AI infrastructure, including a U.S.-UAE deal allowing import of advanced Nvidia AI chips to accelerate data centre development. The region is rapidly emerging as a strategic hub for cutting-edge technology.
Panicker stressed that VLSI research hones students’ analytical and problem-solving skills, preparing them for advanced roles in the global semiconductor industry and enabling contributions to future technology development.
