HUTCH, in collaboration with the University of Sri Jayewardenepura (USJP), hosted a group of undergraduate students from the Faculty of Computing for an insightful industry visit to its Engineering Complex (Data Centre) in Walpola, Ragama, on 17th July 2025. The visit was part of the ongoing Future Connect Program aimed at bridging academic knowledge with practical industry experience.
During the visit, students received hands-on exposure to the core technical infrastructure of one of Sri Lanka’s leading telecom providers. They explored vital operational areas including telecommunications towers, equipment and grounding systems, data center environmental and access controls, and the critical functions of the Network Operations Center.
The program also introduced emerging technology themes such as 5G, IoT integration, and the support systems essential for implementing these innovations at scale. Following the tour, an interactive Q&A session enabled students to engage directly with HUTCH’s engineering professionals, gaining deeper insights into real-world telecom operations.
Mangala Bandara, General Manager, Corporate Affairs at HUTCH, emphasized the company’s commitment to empowering the next generation of technology professionals. “This program offered more than just a site visit; it gave students the opportunity to witness firsthand how skilled engineering teams manage and maintain complex telecom infrastructure,” he said.
By investing in initiatives like Future Connect, HUTCH aims to cultivate a future-ready talent pipeline, inspire innovation among university students, and contribute meaningfully to Sri Lanka’s evolving digital economy.
